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April 3, 2024
Purdue's president said SK Hynix's investment would be the largest ever in Indiana and move the state to the forefront of AI in America.
March 27, 2024
SK hynix will invest around $4 billion in building an advanced chip packaging facility in West Lafayette, a western city of Indiana, USA.
September 18, 2023
Intel recently provided a tour of its chip packaging, assembly, and testing facilities in Malaysia. The Penang Assembly and Test (PGAT) facility assem
August 2, 2023
The data from LexisNexis, released last month, indicates that TSMC and Samsung have steadily invested in advanced packaging technology for years, as Intel did not keep pace with its own filings.
July 25, 2023
(CTN NEWS) - Taiwan Semiconductor Manufacturing Company (TSMC) has recently revealed its ambitious plan to make a substantial investment of approximately