Advanced Microelectronics Packaging News Today

Lockheed Martin posted better-than-expected results in the first quarter, but delivered no F-35s as its ongoing software problems have yet to be resolved.

The technology will help defense systems detect and identify threats with greater speed and accuracy.

The technology will help defense systems detect and identify threats with greater speed and accuracy.

OWEGO, N.Y. Lockheed Martin, Intel Corp., and Altera, an Intel Company, are joining hands to support the Stimulating Transition for Advanced Microelectronics Packaging (STAMP) program for the Office of the Under Secretary of Defense for Research and Engineering (OUSD R&E). Lockheed Martin will develop a low size, weight, and power (SWaP), Sensor Open Systems Architecture (SOSA) aligned airborne electronic defense system, leveraging th...

Lockheed Martin will collaborate with Intel and its newly launched standalone business Altera to build a sensor open systems architecture-based airborne electronic defense platform for the U.S. Navy's MH-60R multi-mission helicopter to support a program of the Office of the Undersecretary of Defense for Research and Engineering. Lockheed said Monday it will use Altera's Multi-Chip Package for integration with the SOSA technology under the Stimulating Transition for Advanced Microelectr...

OWEGO, N.Y.April. 8, 2024- Lockheed Martin will work with Intel Corporation , and Altera, an Intel Company,to support the Stimulating Transition for Advanced Microelectronics Packaging ...

Lockheed Martin will work with Intel Corporation and Altera, an Intel company, to support the STAMP program of the Office of the Under Secretary of Defense for Research and Engineering . Lockheed...

PRINCETON, N.J. RF spectrum specialists BANC3 won a multiyear contract with the U.S Department of Defense (DoD) -- under the auspices of the Pentagon's Stimulating Transition for Advanced Microelectronics Packaging (STAMP) program -- to provide its software defined receiver (SDRX) products on Intel's latest multichip packages, as part of the DoD's broader digital-modernization efforts.

/PRNewswire/ -- BANC3, Inc., today announced that it has been selected under the Stimulating Transition for Advanced Microelectronics Packaging [STAMP] program...

The US Forces Korea (USFK) and the Republic of Korea Army (RoKA) have conducted deployment training for the Terminal High Altitude Area Defense (THAAD) remote launcher. THAAD is a long-range, land-based theatre defence system. The easily tra...