Page 12 - Advanced Packaging News Today

Demand for advanced packaging has been weak so far in 2023 compared to previous years, with high-performance computing (HPC) chips showing better momentum than handset application processors (AP), according to industry sources.

Takeaways from Biden Administration’s Initiative to Promote Equal Opportunity in Federally Funded Infrastructure Projects - On March 14, 2023, the U.S. Department of...

Jiangsu Changjiang Electronics Technology (JCET), the largest China-based OSAT company, has reported revenue and net profits for 2022 both hit record highs of CNY33.76 billion (US$4.91 billion) and CNY3.23 billion. EPS for the year came to CNY1.82.

Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out a test chip with an 8.6Gbps HBM3 Controller and PHY and GLink 2.3LL for AI/HPC/xPU/Networking applications. GLink 2.3LL die-to-die interface provides best-in-class power, performance, and area (PPA) with 5ns end-to-end latency, 5Tbps/mm beach-front (2.5T full-duplex) and 0.27pJ/bit power efficiency. The test chip is taped out at the TSMC 3nm process and adopts the TSMC CoWoS advanced packagin...

Harel Insurance Investments & Financial Services Ltd. boosted its position in Camtek Ltd. (NASDAQ:CAMT – Get Rating) by 2,787.1% during the fourth quarter, according to the company in its most recent disclosure with the Securities & Exchange Commission. The fund owned 431,038 shares of the semiconductor company’s stock after buying an additional 416,108 shares during […]

Paradiem LLC grew its position in Camtek Ltd. (NASDAQ:CAMT – Get Rating) by 20.1% during the fourth quarter, according to the company in its most recent 13F filing with the SEC. The fund owned 23,790 shares of the semiconductor company’s stock after purchasing an additional 3,989 shares during the quarter. Paradiem LLC owned approximately 0.05% […]

On March 27, US President Joe Biden signed a presidential determination (PD) authorizing the use of Defense Production Act (DPA) to support the PCB and Advanced Packaging industry in the United States

OSAT ASE Technology Holding (ASE) is enhancing its automotive IC solutions including sensors, ECUs, and power devices, stepping up its deployment in the automotive electronics sector.

U.S. government will spend $50 million to support domestic PCB and advanced packaging facilities.

A teacher's thoughts on the last day.