Hips Components News Today

ASE Technology and other OSATs capable of providing advanced packaging technology are all gearing up for a boom in demand for chiplets.

TSMCs Advanced Backend Fab 6, the foundrys first all-in-one automated advanced packaging and testing fab to realize 3DFabric front-end to back-end process and testing services integration, has opened.

The recent partnership between STMicroelectronics and China-based Sanan Optoelectronics is the latest case showing the European automotive supply chain is striving to gain a presence for its SiC devices in China.

Taiwan-based CMOS imagery sensor (CIS) packaging giant Tong Hsing Electronics, an affiliate of the Yageo Group, has been working actively to make adjustments to its shareholding in its joint venture XSemi with Foxconn Electronics (Hon Hai Technology Group) to maximize the resources invested, said president of Tong Hsing and XSemi CS Chang during a recent company investor conference.

DRAM contract prices are likely to bottom out in the third quarter of 2023 while the NAND flash segment will reach the lowest point in the fourth quarter, according to memory module company Adata Technology.

In the annual sessions of the National Peoples Congress (NPC) and the National Committee of the Chinese Peoples Political Consultative Conference (CPPCC), the so-called "Two Sessions" that ended in March, the focus was undoubtedly on the autonomy of semiconductor technology. But AI was also mentioned quite a few times.

Taiwan-based semiconductor tool vendors stand a chance of breaking into the supply chain for Apples iPhones by supplying RF peripheral IC test equipment, according to industry sources.

STMicroelectronics (ST) announced it would form a joint venture with China-based counterpart Sanan Optoelectronics to secure a share in Chinas rapidly growing vehicle and industrial electrification market despite an ongoing geopolitical risk confronting the semiconductor industry.

Competition in the AI GPU market is heating up between Nvidia and Advanced Micro Devices (AMD), as data center firms look to diversify AI GPU sources and AMDs MI300 offers another alternative.

A recent patent lawsuit filed by US-based gallium nitride (GaN) technology specialist Efficient Power Conversion Corp (EPC) against Chinas top GaN devices vendor Innoscience Technology is likely to deter the latter from developing its sales abroad.