Page 2 - Hips Components News Today

Realtek Semiconductor has filed a federal lawsuit in the Northern District of California against MediaTek, Future Link Systems, and Future Links parent company, IPValue Management, alleging that patent assertion entities (PAE) Future Link and IPValue conspired with MediaTek and violated the federal Sherman Act and Californias Unfair Competition Law by entering into an illegal "bounty" agreement that incentivized Future Link to improperly sue Realtek.

Inventec Corp., a Taiwan-based original design manufacturer for PCs and servers, disclosed that its AI accelerator VectorMesh has attracted several top-10 IC design companies in Taiwan, and ICs with the accelerator inside is expected to be manufactured in Q4 of 2023.

SK Hynix has begun mass production of its 238-layer 4D NAND flash memory, and product compatibility testing is presently being conducted with a global smartphone manufacturer, according to the memory chipmaker.

IC distributor Edom Technology expects its inventory to revert to normal levels as early as the third quarter of 2023.

DRAM chipmaker Nanya Technology and Winbond Electronics, a maker of specialty DRAM and flash memory, both saw their May revenue increase 2.2% and nearly 8%, respectively, on month, while revenue at mask ROM and flash chipmaker Macronix International declined 24.2%.

In a media debrief following the shareholder meeting, Huang Shui-Ke, president of Chunghwa Precision Test (CHPT), outlined the companys struggle in the previous year. The first quarter of 2023 was particularly challenging, resulting in minor losses. However, the firm is on track to attain a break-even point in the second quarter, with a potential profit margin surfacing, according to Huang.

The logic IC sector has seen some short lead-time orders for AI and automotive chips, according to silicon wafer supplier Formosa Sumco Technology.

The market for edge AI computing devices is poised to enter a period of expansion, driven by the current popularity of generative AI applications, according to sources at IC design houses.

Inventory adjustments for passive components are ongoing amid unfavorable macro conditions, according to Yageo chairman Pierre Chen, who anticipates L-shaped recovery in the second half of this year.

Apple unveiled its mixed reality (MR) device, Vision Pro, at the 2023 WorldWide Developers Conference (WWDC). The device marks a path toward what could be a new era of spatial computing. However, due to its limited demand and lofty price point, the product is viewed more as a tech demonstrator rather than a commercially feasible device.