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Tong Hsing eyes accelerating MOSFET biz dev: Q&A with company president C S Chang

Taiwan-based CMOS imagery sensor (CIS) packaging giant Tong Hsing Electronics, an affiliate of the Yageo Group, has been working actively to make adjustments to its shareholding in its joint venture XSemi with Foxconn Electronics (Hon Hai Technology Group) to maximize the resources invested, said president of Tong Hsing and XSemi CS Chang during a recent company investor conference.

New US GaN patent war may cripple exports of top China vendor

A recent patent lawsuit filed by US-based gallium nitride (GaN) technology specialist Efficient Power Conversion Corp (EPC) against China s top GaN devices vendor Innoscience Technology is likely to deter the latter from developing its sales abroad.

Inventory correction for passive components persists, says Yageo

Inventory adjustments for passive components are ongoing amid unfavorable macro conditions, according to Yageo chairman Pierre Chen, who anticipates L-shaped recovery in the second half of this year.

CWTC likely to report higher-than-anticipated 2Q23 revenue

IC packaging leadframe supplier Chang Wah Technology (CWTC), which saw its monthly revenue exceed NT$1 billion (US$32.5 million) for the second consecutive month in May, is likely to report higher-than-anticipated revenue for the second quarter of 2023, according to the company.

IC socket orders for Nvidia chips ramping up

GPU vendor Nvidia has placed additional orders for various products with IC test socket manufacturers, according to industry sources.

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