Ther Ic Components News Today

Taiwan-based CMOS imagery sensor (CIS) packaging giant Tong Hsing Electronics, an affiliate of the Yageo Group, has been working actively to make adjustments to its shareholding in its joint venture XSemi with Foxconn Electronics (Hon Hai Technology Group) to maximize the resources invested, said president of Tong Hsing and XSemi CS Chang during a recent company investor conference.

A recent patent lawsuit filed by US-based gallium nitride (GaN) technology specialist Efficient Power Conversion Corp (EPC) against Chinas top GaN devices vendor Innoscience Technology is likely to deter the latter from developing its sales abroad.

Inventory adjustments for passive components are ongoing amid unfavorable macro conditions, according to Yageo chairman Pierre Chen, who anticipates L-shaped recovery in the second half of this year.

IC packaging leadframe supplier Chang Wah Technology (CWTC), which saw its monthly revenue exceed NT$1 billion (US$32.5 million) for the second consecutive month in May, is likely to report higher-than-anticipated revenue for the second quarter of 2023, according to the company.

GPU vendor Nvidia has placed additional orders for various products with IC test socket manufacturers, according to industry sources.

Although the IC substrate market appears to be declining this year compared to 2022, it is actually returning to a healthy state, according to Jack Lu, senior VP of Nan Ya PCB.

Nidec and Renesas Electronics have agreed to collaborate on the development of semiconductor solutions for a next-generation e-axle (X-in-1 system) that combines an electric vehicle (EV) drive motor and power electronics, according to the companies.

Apple CEO Tim Cook unveiled its first mixed reality headset VisionPro at the WWDC 2023 keynote on June 5, attracting attention and cheering from Apple fans worldwide. There are some interesting facts behind this years WWDC which may have escaped the most discerning eyes, especially the marvels to be performed with new features enabled by the chips used in the gadgets.

For suppliers of GaAs-based RF power amplifiers (PAs), market demand for handsets and other consumer electronics devices will remain weak, but demand for niche-market applications such as aerospace, military, industrial control and infrastructure continue to provide robust momentum, which will help them to offset declines in shipments for consumer applications, according to industry sources.

Member firms of the Foxconn (Hon Hai Precision Industry) camp have completed their initial deployments in the third-generation compound semiconductor SiC (silicon carbide) field, with Taisic Materials engaged in the upstream crystal growth and substrate production, Gigastorage planning to handle SiC wafer cutting, grinding and polishing, and Hon Hai itself on track to operate a SiC wafer foundry at a 6-inch fab purchased from Macronix International in addition to its deep presence in consumer, i...