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NVIDIA and AMD have reserved all of TSMC s CoWOS and SoIC advanced packaging for 2024 and 2025

NVIDIA and AMD have purchased all of TSMC's advanced packaging production capacity including CoWoS and SoIC for 2024 and 2025: they're 'fully booked'.

TSMC to expand advanced packaging capacity at 3 plants: CoWoS, SoIC, SoW for AI GPU demand

The unstoppable demand of AI and one of the keys apart from the GPU and HBM is advanced packaging production, something TSMC is boosting right now.

Samsung establishes dream team of engineers to win AI chip orders from NVIDIA

Samsung has established a team for billions of dollars worth of HBM memory chip supply deals with NVIDIA, to beat HBM leader SK hynix.

HBM prices to increase 5-10% in 2025, while DDR5 prices to increase 15-20% for PC gamers

SK hynix and Micron are sold out of 2024 + 2025 HBM supply, with TrendForce estimating a 5-10% increase in HBM memory pricing in 2025.

SK hynix expects HBM memory chip revenues of over $10 billion in 2024

SK hynix expects to hit $10+ billion in revenue from HBM sales by the end of 2024, as most of its HBM 2024 and even HBM 2025 supply is already sold out.

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