Page 22 - Advanced Packaging News Today

Department of Health and Human Services Our summary, below, focuses on what we see as the key risk areas and challenges, as well as certain of the resulting recommendations identified by each reviewing agency. I. Semiconductor Manufacturing and Advanced Packaging (Department of Commerce) Key Risks and Challenges Fragile supply chains. Semiconductor supply chains are immense, and require vast inputs and resources to function properly. Because the industry is highly specialized and geographically...

Advanced Packaging Market is Booming Worldwide With Samsung Electronics, Intel, Advanced Semiconductor Engineering

YES (Yield Engineering Systems, Inc.) and SPEC (Semiconductor Process Equipment Corp.) Sign Strategic Alliance Agreement Share Article Agreement covers design, manufacture and distribution of semiconductor equipment “We look forward to combining our knowledge base with YES’s large and ever-growing repository of process expertise to address customer needs,” said Kevin McGillivray, co- founder of SPEC. FREMONT, Calif. (PRWEB) J...

New, sustainable, customized snack veggie packaging

Reading time ( words) At the 30th anniversary of NEPCON China, Koh Young Technology, the industry leader in True3D measurement-based inspection solutions will exhibit a full suite of inspection and process control solutions at NEPCON China in Booth 1H15 Zone A on April 21-23, 2021 at the Shanghai World Expo Exhibition & Convention Centre. During the exhibition, Koh Young will exhibition eight products that solve electronics assembly challenges: 1.   KY8030-3: The Industry’s Fastest True 3...

YES Joins Forces with EV Group Competence Center in Austria YES ( Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and "More-than-Moore" applications, today announced it is working with EV Group (https://www.evgroup.com/) and will install a YES EcoCoat monolayer coating system at EVGs NILPhotonics Competence Center in Austria. This collaboration will provide complete process flow demos for prospective semiconductor...

Yield Engineering Systems, Inc. Joins Forces with EV Group Share Article YES EcoCoat™ to be installed at EVG’s NILPhotonics® Competence Center in Austria We believe that this collaboration with EVG will help us to showcase our technologies to companies developing breakthrough products in the semiconductor, life science and AR/VR markets,” said Rezwan Lateef, President of YES. FREMONT, Calif. (PRWEB) April 19, 2021 YES (Yiel...

Winstek Places Second Order for YES (Yield Engineering Systems, Inc.) VertaCure™ XP Share Article YES today announced that it will deliver another VertaCure™ XP, the latest version of its flagship VertaCure vacuum curing system, to Winstek Semiconductor Co., Ltd. “The VertaCure XP system’s enhanced capabilities make it especially well-suited for the demands of ‘Beyond Moore’ advanced packaging, and its ability to handle both 200 mm and 300 mm wafers is ideal for our WLCSP applicatio...

ERS electronic Appoints Joshua Zhou as Vice President ERS electronic, the innovation leader in thermal management solutions for the semiconductor manufacturing industry, is appointing Joshua Zhou as Vice President. Zhou joined the company as Sales and Marketing Director in 2018 when ERS opened its China sales office in Shanghai. Joshua has more than twenty years of experience in the semiconductor industry, with global players like Texas Instruments, but also local Chinese actors like Hangzhou N...

YES Receives VertaBond™ Purchase Order from a Tier 1 Memory Manufacturer Share Article Yield Engineering Systems, Inc. announces that a leading memory manufacturer has ordered the YES VertaBond™ system for wafer-to-wafer and die-to-wafer bonding, utilized in bringing next-generation HBM (high bandwidth memory) to market. "This new VertaBond system will enable our valued customer’s most advanced HBM development and pilot production,” said Alex Chow, Asia Sales President & General Manager...