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March 2, 2022
Breakthrough wafer-level optics technologies help solve a key challenge of connecting many fibers to silicon chips for datacom and telecom applications ST. FLORIAN, Austria and JERUSALEM
March 2, 2022
Breakthrough wafer-level optics technologies help solve a key challenge of connecting many fibers to silicon chips for datacom and telecom
April 20, 2021
YES Joins Forces with EV Group Competence Center in Austria YES ( Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and "More-than-Moore" applications, today announced it is working with EV Group (https://www.evgroup.com/) and will install a YES EcoCoat monolayer coating system at EVGs NILPhotonics Competence Center in Austria. This collaboration will provide complete process flow demos for prospective semiconductor...
April 19, 2021
Yield Engineering Systems, Inc. Joins Forces with EV Group Share Article YES EcoCoat™ to be installed at EVG’s NILPhotonics® Competence Center in Austria We believe that this collaboration with EVG will help us to showcase our technologies to companies developing breakthrough products in the semiconductor, life science and AR/VR markets,” said Rezwan Lateef, President of YES. FREMONT, Calif. (PRWEB) April 19, 2021 YES (Yiel...