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VeriSilicon Joins the Universal Chiplet Interconnect Express Industry Consortium

Press release content from Business Wire. The AP news staff was not involved in its creation.

United statesMiya kongWayne daiIntel corporationService sipaaMicrosoft corporationNeural network processorVerisilicon microelectronics shanghai co ltdTaiwan semiconductor manufacturing companySemiconductor engineering incQualcomm incorporatedSilicon platformUniversal chiplet interconnect expressAdvanced semiconductor engineeringGoogle cloudGraphics processor unit

VeriSilicon Joins the Universal Chiplet Interconnect Express Industry Consortium - Press Release

Membership will drive VeriSilicon's industrialization of chiplet-based projects and support aim of becoming a leading provider of commercialized chipl

United statesWayne daiIntel corporationService sipaaMicrosoft corporationNeural network processorVerisilicon microelectronics shanghai co ltdTaiwan semiconductor manufacturing companySemiconductor engineering incQualcomm incorporatedSilicon platformUniversal chiplet interconnect expressAdvanced semiconductor engineeringGoogle cloudGraphics processor unitVideo processor unit

Tech Giants Form Consortium to Standardize On Chiplet Interfaces

Leading tech companies have formed an industry consortium to develop a standard interconnect scheme for chiplets,

Debendra das sharmaGordon mooreTaiwan semiconductor manufacturing companySemiconductor engineering incWatch thisAdvanced semiconductor engineeringGoogle cloudCompute express linkIntel senior fellowChief architectStandards promoter memberInfinity fabricUniversal chiplet interconnect express

Understanding COVID-19 s impact on the Ball Grid Array (BGA) Packaging Market, Infers FMI

Understanding COVID-19 s impact on the Ball Grid Array (BGA) Packaging Market, Infers FMI
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How Is The Semiconductor And Other Electronic Component Market Working To Reduce Energy Consumption?

How Is The Semiconductor And Other Electronic Component Market Working To Reduce Energy Consumption?
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