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Industry leaders foster open ecosystem for chiplet design

Industry leaders foster open ecosystem for chiplet design
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New Electronics - Industry leaders join forces to standardise chiplet ecosystem

New Electronics - Industry leaders join forces to standardise chiplet ecosystem
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Intel, TSMC, Samsung, Arm, Google, Microsoft Form Consortium To Define Standards For Advanced Chip-Packaging Tech As Moore s Law Slows Down

Intel, TSMC, Samsung, Arm, Google, Microsoft Form Consortium To Define Standards For Advanced Chip-Packaging Tech As Moore s Law Slows Down
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Various Video Game Stories from the Week of February 28 - Industry News

Various Video Game Stories from the Week of February 28 - Industry News
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Industry Spec Paves Way for Processors Built on Chiplets From Multiple Vendors

AMD, Intel, and Arm agree to use the new 'UCIe' specification to create processors that can combine chiplets from multiple vendors over a single unit.

Mark papermasterSandra riveraLihong caoTaiwan advanced semiconductor engineeringUniversal chiplet interconnect expressExecutive vice president sandra riveraGoogle cloudAdvanced semiconductor engineeringComputers amp electronics