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May 7, 2024
Tata Electronics, a company based in Bengaluru, India, has begun exporting small amounts of semiconductor chips. This is a significant step that could improve Indias ability to produce these important components. The chips are being packaged at a pilot production line located at Tata Electronics research and development center. This information comes from people with knowledge of the situation but who do not want to be identified publicly.
May 7, 2024
India Business News: Tata Electronics Ltd has started exporting semiconductor chips packaged at a pilot line in Bengaluru to partners in Japan, US, and Europe. The company
May 7, 2024
Tata Electronics: A second person said the company is also in near final stages for a successful tape-out of semiconductor chips in 28, 40, 55, 65 nm (nanometre), and some other higher nodes. A tape-out refers to the final result of the designing process for integrated circuits or printed circuit boards before they are sent for manufacturing.
April 23, 2024
SkyWater has partnered with Deca Technologies to develop a multi chip packaging capability that will lower the entry barriers to advanced packaging.
March 13, 2024
Samsung has decided to step into the next generation of packaging technology as the firm initiates R&D work for "Glass Substrate".
January 18, 2024
India Business News: Foxconn teams up with HCL Group to start a chip packaging and testing venture in India. Foxconn will invest $37.2 million for a 40% ownership in the j
January 17, 2024
Foxconn and HCL Group are set to enter a joint venture to set up a chip packaging and testing facility in India, as the long-time Apple partner diversifies from China. Foxconn Hon Hai Technology India Mega Development, a subsidiary of the Taiwanese parent Foxconn, will invest $37.2 million for a 40% stake, it disclosed in a Taiwan Stock Exchange filing. Rest of the stake will be held by HCL. The two entities will together set up a outsourced semiconductor assembly and testing facility.
January 17, 2024
Nadar Malhotra stated that HCL Group sees Foxconn as a great strategic partner. “A lot a lot of people know them much more for their manufacturing prowess, but a big part of the universe of their manufacturing is the work that they do (is) in semiconductor design.”
December 21, 2023
Japans industry ministry said it would provide Samsung subsidies worth up to 20 billion yen as it looks to support the revitalisation of domestic chip manufacturing.
December 21, 2023
Samsung Electronics: Japans industry ministry said it would provide Samsung subsidies worth up to 20 billion yen as it looks to support the revitalisation of domestic chip manufacturing.