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May 27, 2024
Googles Pixel 10 is set to feature a new Tensor G5 chip made by TSMC, moving away from Samsung, aiming for performance enhancements.
May 27, 2024
It has been revealed that Google's next flagship smartphone chip, the Tensor G5, is made by TSMC and not Samsung Foundry. - SamMobile
May 26, 2024
MOBILES & TABLETS News: Google's upcoming Pixel 10 smartphone will feature the company's first fully custom Tensor chip manufactured by TSMC. The Tensor G5, codenamed 'Laguna
May 26, 2024
Discover the exciting advancements coming to Google Pixel phones! The AI-focused Tensor G5 in the Pixel 10 Series!
May 26, 2024
Google is rumored to ditch relying on Samsung for its Tensor chip production. New information now adds evidence to the same.
May 26, 2024
The Google Tensor G5, the chip in the Google Pixel 10, will be manufactured by TSMC, and we have the proof.
May 7, 2024
In a move expected to boost Indias semiconductor prowess, Tata Electronics Ltd has started exporting limited quantities of semiconductor chips packaged at a pilot line at its Bengaluru-based research and development centre, people familiar with the matter told ET.
May 7, 2024
Tata Electronics, a company based in Bengaluru, India, has begun exporting small amounts of semiconductor chips. This is a significant step that could improve Indias ability to produce these important components. The chips are being packaged at a pilot production line located at Tata Electronics research and development center. This information comes from people with knowledge of the situation but who do not want to be identified publicly.
May 7, 2024
India Business News: Tata Electronics Ltd has started exporting semiconductor chips packaged at a pilot line in Bengaluru to partners in Japan, US, and Europe. The company
May 7, 2024
Tata Electronics: A second person said the company is also in near final stages for a successful tape-out of semiconductor chips in 28, 40, 55, 65 nm (nanometre), and some other higher nodes. A tape-out refers to the final result of the designing process for integrated circuits or printed circuit boards before they are sent for manufacturing.