Backside Power News Today

Intel incorporates graphene for next-level semiconductor performance, boosting speed and efficiency in future computing applications.

Operator: Welcome to the Applied Materials Earnings Conference Call. During the presentation, all participants will be in a listen-only mode.

TSMC founder Morris Chang says that despite Intels comments about taking process leadership from TSMC, Intel will remain in TSMCs shadow.

Imec, the most advanced semiconductor research firm in the world, recently shared its silicon and transistor roadmap at its ITF World summit in Antwerp, Belgium.

Intel will soon be showcasing its next-generation & backside power delivery technology known as PowerVia in an "Intel 4" E-Core chip.