Global 3D IC and 2.5D IC Packaging Market to Reach $6.4 Billion by 2030. In the changed post COVID-19 business landscape, the global market for 3D IC and 2.5D IC Packaging estimated at US$3.3 Billion in the year 2022, is projected to reach a revised size of US$6.4 Billion by 2030, growing at a CAGR of 8.7% over the analysis period 2022-2030.New York, July 03, 2023 (GLOBE NEWSWIRE) Reportlinker.com announces the release of the report "Global 3D IC and 2.5D IC Packaging Industry" - https://www.
Data center construction industry size is expected to register 7.4% CAGR between 2023 and 2032 propelled by the increasing number of new data centers in.
When claims survive an inter partes review, a petitioner has only limited options to challenge the surviving claims either at the patent office or in district court.
Who Bears the Burden of Proof for IPR Estoppel? In Ironburg Inventions Ltd. v. Valve Corp., Appeal No. 21-2296, the Federal Circuit held that the patentee has the burden .