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Chip design matters for EU, but packaging is even more crucial | Business | Economy and finance news from a German perspective | DW

Researchers have urged EU member countries to invest a lot more in chip design, with a view to becoming less dependent on China. Yet other parts of the value chain require more attention.
Bruxelles Capitale John Lee Jan Peter Kleinhans Stiftung Neue Verantwortung Annett Fischer Mercator Institute For China Studies
Source: dw.com

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A new Supply Chain News Report Claims that Apple has begun to use TSMC's 3DFabric Technology

In June 2021 Patently Apple posted a report titled "TSMCs 3DFabric Technology is the next big wave in Chip Design that Apple will take advantage of in the not-too-distant Future." A new report out of Taiwan today confirms that Apple has begun using TSMCs 3DFabric. The report noted that "Yu Zhenhua, TSMCs vice president of research and development pointed out...
Bob Borchers Yu Zhenhua Dfabric Technology Chip Design Patently Apple Tim Millet

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