Page 18 - Chip Design News Today

PASCAGOULA, Miss., May 27, 2021 (GLOBE NEWSWIRE) -- Huntington Ingalls Industries’ (NYSE: HII) Ingalls Shipbuilding division announced today that Brian Blanchette has been promoted to vice president of quality and engineering. Blanchette will be responsible for the management and oversight of the division’s quality program as well as all ship design, engineering, integrated logistics support and planning yard engineering efforts. He will relieve Dave Belanger upon his retirement in...

Efabless launches chipIgnite with SkyWater Efabless, a community chip creation platform, has launched its new chipIgnite program to extend chip design and fabrication and a collaboration with SkyWater Technology for the first node supported in the program. The chipIgnite program expands upon the SKY130-based open source chip manufacturing program sponsored by Google and supports private commercial designs that include non-open source IP. This initiative is being seen as ...

Summary Khursheed Aurangzeb is Associate Professor in Department of Computer Engineering at College of Computer and Information Sciences at King Saud University (KSU), Riyadh, Saudi Arabia. He received his Ph.D. degree in Electronics Design from Mid Sweden University Sweden in June 2013, MS degree in Electrical Engineering (System on Chip Design) from Linkoping University, Sweden in 2009. He received his B.S. degree in Computer Engineering from COMSATS Institute of Information Technology Abbott...

Share: Aims to further deepen Chip Design and ASIC engineering capabilities and global presence Tessolve, a Hero Electronix venture and a global provider of engineering and R&D services to semiconductor companies, has raised $40 million from Novo Tellus Capital Partners, a leading private equity firm based out of Singapore at a $100 million valuation. The funding will be used by Tessolve to drive further growth through acquisitions and organic investments. Since a majority investment by Hero E...

The deal is opposed by Big Tech, and the rise of RISC-V adoption is a threat for Arm Holdings

Apple recently announced plans to produce its own 5G chips and modems and the company may be one step closer to doing so. The Cupertino giant has

The new facility will be located in Munich and will be Europe's largest development site for mobile wireless semiconductors.

Also in todays EMEA regional roundup: Deutsche Telekom combines on EVs, again; Apple plans European chip center; how to regulate online services; and more. Can net neutrality be made to work for network operators? Thats the question being posed by BTs Marc Allera, who uses a personal blog to declare that now is the time to "explore what the future [of network neutrality] should look like." According to Allera, the coronavirus pandemic has shown that there are "very good reasons to enable prefer...

Our NanoNews Digest Sponsors Home > Press > CEA-Leti & Dolphin Design Report FD-SOI Breakthrough that Boosts Operating Frequency by 450% and Reduces Power Consumption by 30%: Joint Paper Presented at ISSCC 2021 Shows How New Adaptive Back-Biasing Technique Overcomes Integration Limits in Chip Design Flows Abstract: CEA-Leti and Dolphin Design have developed an adaptive back-biasing (ABB) architecture for FD-SOI chips that can be seamlessly integrated in the digital design flow with industrial-...

MIT aims to speed up robot movements to match robot thoughts using custom chips Read full article Robot and human working together. MIT researchers are looking to address the significant gap between how quickly robots can process information (relatively slowly), and how fast they can move (very quickly thanks to modern hardware advances), and theyre using something called "robomorphic computing" to do it. The method, designed by MIT Computer Science and Artificial Intelligence (CSAIL) graduate ...