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March 13, 2024
ADAS chiplet reference design and software development platform based on the latest Automotive Enhanced technologies from Arm accelerate time-to-market for SDVs ...
February 20, 2024
Highlights: Multiyear agreement to enable best-in-class system-on-chips for the AI, high performance computing and mobile markets. Joint development on customized intellectual property ,...
February 20, 2024
SANTA CLARA, Calif. & SAN JOSE, Calif.--(BUSINESS WIRE)--Feb 20, 2024--
September 29, 2023
You may have heard of PCIe if you're a PC builder or have purchased an SSD, but UCIe is something rather different.
April 1, 2022
This article discusses in detail the background and importance of the recently established Universal Chiplet Interconnect (UCIe) Standard for use in the semiconductor industry.
March 15, 2022
What challenges would a non-unified chiplet industry present, what is UCIe, and will it help accelerate future semiconductor developments?
March 3, 2022
To set a industry standard for chip packaging and stacking, giants like Samsung, TSMC, Intel, Meta, Microsoft, and others are forming a consortium. - SamMobile
March 3, 2022
Advanced Semiconductor Engineering, Inc. (ASE), AMD, Arm, Google Cloud, Intel Corporation, Meta, Microsoft Corporation, Qualcomm Incorporated, Samsung, and Taiwan Semiconductor Manufacturing Company today announced the formation of an industry consortium that will establish a die-to-die interconnect standard and foster an open chiplet ecosystem.