Page 4 - Chips Components News Today

SiFive, the pioneer and leader of RISC-V computing, has announced that it is giving its WorldGuard security model to RISC-V International. This move aims to provide the RISC-V community with a standardized approach to securing their designs and accelerating their time-to-market.

Semiconductor and PCB equipment maker Csun Manufacturing has seen improvement in order visibility for the third quarter and anticipates a gradual sales recovery in the second half of this year.

Semiconductor foundries in Japan and Europe spend at least double the amount of what similar establishments in the U.S., South Korea, and Taiwan do on electricity, according to a strategic proposal submitted to the Japanese Ministry of Economy, Trade, and Industry (METI) by the Semiconductor Division of the Japan Electronics and Information Technology Industries Association (JEITA).

Chinese smartphone maker Oppo disbanded its chip design house Zeku in May, stimulating commentary on Zeku being the latest victim of the US-China chip war among the media in China. However, blaming geopolitical pressure for Zekus failure does not help stakeholders to prevent the same mistake from recurring. Zekus CEO Liu Jun and Oppo founder Duan Yongping made it clear: with sales far lower than expected, the investment needed for self-designed chips went through of the roof and it became prohib...

Marvell Technology has announced plans to establish a world-class design center in Ho Chi Minh City. The facility will house advanced semiconductor engineering and will be a top technology workplace for those looking to upgrade their skills and careers, according to the US chip vendor.

Taiwan-based First Hi-tec Enterprise (FHt), a niche-market PCB manufacturer, will continue to focus on automotive applications, such as high-wattage power boards used in fast charging, to drive its future growth.

DDR5 memory will be the first of all memory categories to see prices stop falling and start rebounding, according to sources at memory module houses.

Semiconductor Equipment and Materials International (SEMI), TECHCET, and TechSearch International jointly published "Global Semiconductor Packaging Materials Outlook" report on May 24, predicting that the size of global semiconductor packaging and assembly materials will increase from US$26.1 billion in 2022 to US$29.8 billion in 2027, at a compound average growth rate of 2.7%.

Most IC design houses are generally uncertain about the prospects for the second half of 2023, as many end-market brand vendors and channel operators of consumer electronics products have expressed pessimism about demand in the second half.

Electronic components, notably semiconductors, remain a significant source of Taiwanese exports, despite the country seeing its sixth consecutive month of on-year decreases in electronic component export orders in April 2023.