Intel to keep Moore's Law alive with 3D stacked CMOS transistors with backside power
As technology advances, the demand for faster computation is increasing, leading chip designers to seek ways to integrate more components into processors. At IEDM 2023, during a technical session, Intel researchers demonstrated their latest technological breakthrough that will allow just that: 3D-stacked CMOS transistors with backside power and direct backside contact. Intel claims this breakthrough …
Source: kitguru.net