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Intel introduces quasi-monolithic chips for next-gen 3D packaging, teases an incredible 1 trillion transistors on a single package by 2030.

Intel announced that it will be able to stuff one trillion transistors into an IC package by 2030.

Intel released nine research papers at the IEDM 2022 conference outlining its advances in 2D transistors, 3D packaging, and new memory and quantum computing technologies.

Earlier this year, Nvidia's Jensen Huang declared Moore's Law dead (again) during a 4000-series launch Q&A session. The prediction echoed similar statements made by Huang during the...

The Intel Labs and Components Research organizations have demonstrated the industry’s highest reported yield and uniformity to date of silicon...

Intel claims it has reached a major milestone with quantum chip production. Its among the first to create multiple working quantum chips on a single wafer, and is confident of the utility value of it

Intel demonstrates exceptional yield of quantum dots arrays, showing promise for large-scale qubit production using transistor fabrication technology. ... | October 5, 2022

Dec. 11, 2021 -- In its relentless pursuit of Moore’s Law, Intel is unveiling key packaging, transistor and quantum physics breakthroughs fundamental to

11.12.2021 - What’s New: In its relentless pursuit of Moore’s Law, Intel is unveiling key packaging, transistor and quantum physics breakthroughs fundamental to advancing and accelerating computing well into the next decade. At IEEE International Electron ... Seite 1

SANTA CLARA, Calif.--(BUSINESS WIRE)--Dec 11, 2021--