Intel Technology Development News Today

Our selection of industry specific magazines cover a large range of topics.

As chip packaging gets more advanced, Intel has said it aspires to put a trillion transistors in a package by 2030 with his next-generation chip packaging technology.Intel has led the industry in advanced packaging for a couple of decades.Its ...

Intel has given a close-up of its next-gen Meteor Lake client & Granite Rapids data center CPUs which utilize advanced packaging technologies.

Intel’s Ann Kelleher showed a render of the new Complementary FET (CFET) transistor during her presentation at imec’s ITF World conference.

Dec. 11, 2021 -- In its relentless pursuit of Moore’s Law, Intel is unveiling key packaging, transistor and quantum physics breakthroughs fundamental to

SANTA CLARA, Calif.--(BUSINESS WIRE)--Dec 11, 2021--

Intel also noted that its new and next-gen technologies were developed in close collaboration with partners in both the U.S. and Europe, which the company said are “key to bringing foundational innovations from the lab to high-volume manufacturing.”