Corning's Ultra-Low TTV Glass Carrier Wafers
Corning Incorporated has announced the launch of its new Ultra-Low TTV Glass Carrier Wafers, which enable advanced semiconductor manufacturing as well as applications for 5G connectivity. The launch builds on the company’s existing portfolio that supports these rapidly growing markets.
San Diego United States Corning Incorporatedjun Michael Mueller Precision Glass Solutions Corning Carrier Solutions
Source: azom.com