D Fabric Technology News Today

M2 Extreme was supposed to be the most powerful Apple chip ever — and while it never materialized, Taiwan Semiconductors new manufacturing method could bring the dream back.

In June 2021, Patently Apple posted a report titled "TSMCs 3DFabric Technology is the next big wave in Chip Design that Apple will take advantage of in the not-too-distant Future." The news was rolled into an Apple patent titled "High Density Interconnection using Fanout Interposer Chiplet." Today were learning that Apple is testing ...