Page 2 - Dan Kochpatcharin News Today

Alphawave Semi LSE AWE a global leader in highspeed connectivity and compute solutions for the worlds technology infrastructure today announced the successful bringup of its first chipletconnectivity silicon platform on TSMCs most advanced 3nm process.

Alphawave Semi, a developer of high-speed connectivity and compute solutions, has revealed that it has successfully demonstrated its first chiplet-connectivity silicon platform based on TSMC’s most advanced 3nm process.

Alphawave Semi today announced the successful bring-up of its first chiplet-connectivity silicon platform on TSMC’s most advanced 3nm process.

The TSMC DCA program focuses on chip-implementation services and system-level design solutions to help lower design barriers for customers adopting TSMC technology.

Awards Recognize Synopsys Significant Contribution to Driving Advanced-Node Silicon Success and Technology Innovation Leadership Highlights: Certification of...

Ansys receives four awards for joint development of advanced silicon signoff capabilities, 3D-IC prototyping, RF design, and partner collaboration / Key Highlights Ansys secured an award in the...

Siemens Digital Industries Software have announced new certifications and collaborations with TSMC, resulting in the successful qualification of multiple Siemens EDA product lines for the foundry’s latest process technologies.

Cadence digital full flow includes key new technologies, including a high-accuracy and massively scalable parasitic 3D field solver AI-powered Cadence Cerebrus enabled for N2 provides customers with productivity improvements Custom/analog flow based on AI-powered Virtuoso Studio supports circuit optimization and has been enhanced, providing up to 3X throughput for design migration Mutual customers actively designing…

Cadence Design Systems is making available new system prototyping flows based on the Cadence Integrity 3D-IC Platform that support the 3Dblox 2.0 standard.

ProteanTecs, a company specialising in deep data analytics for advanced electronics, has joined the TSMC Open Innovation Platform (OIP) 3DFabric Alliance.