Dan Kochpatcharin News Today

UPDATE: Revised for clarity as these are chip designs, not chips Arm has announced its latest development in mobile technology: the AI-optimized Arm Compute Subsystems (CSS) for Client. These new chip designs are designed to bring even more power and efficiency to smartphones and other mobile devices, making them faster and smarter. Key Points New…

Highlights: Production-ready digital and analog design flows, powered by Synopsys.ai™ EDA suite, on TSMC N3/N3P and N2 drive successful results and accelerate analog design migration Certified Synopsys physical verification solution on TSMC N3P and N2 nodes accelerates full-chip physical signoff Collaboration on silicon photonics leveraging Synopsys 3DIC Compiler and Photonics IC solution and TSMC's COUPE technology to further…

Siemens Digital Industries Software has announced that its ongoing collaboration with TSMC has successfully achieved multiple new product certifications and project milestones on the latest advanced processes.

Synopsys has announced significant EDA and IP collaborations with TSMC for advanced node designs.

New flow provides an efficient, integrated radio frequency circuit re-design solution based on Synopsys Custom Design Family, Keysight Electromagnetic Simulation, and Ansys Device Synthesis Integrated flow accelerates migration of existing N16 process passive radio frequency devices to the advanced N6RF+ technology node for better power, performance, and area results April 24, 2024 SANTA ROSA, Calif.,…

Collaboration on TSMCs COUPE silicon photonics platform dramatically speeds chip-to-chip and machine-to-machine communication for cloud, datacenters, HPC, and...

Collaboration on AI-Driven Design Flows for Optimization and Productivity, Advancements in Photonic IC Integration, Plus Broad IP Development on TSMC 2nm Technology Highlights: Production-ready...

Cadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to...

Collaboration on TSMCs COUPE silicon photonics platform dramatically speeds chip-to-chip and machine-to-machine communication for cloud, datacenters, HPC, and AI chips / Key Highlights Ansys and...

Silicon Creations, a supplier of high-performance analog and mixed-signal IP, has reached a significant milestone: surpassing 10 million wafers in production containing its IP in collaboration with semiconductor foundry TSMC.