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April 26, 2024
Highlights: Production-ready digital and analog design flows, powered by Synopsys.ai™ EDA suite, on TSMC N3/N3P and N2 drive successful results and accelerate analog design migration Certified Synopsys physical verification solution on TSMC N3P and N2 nodes accelerates full-chip physical signoff Collaboration on silicon photonics leveraging Synopsys 3DIC Compiler and Photonics IC solution and TSMC's COUPE technology to further…
April 25, 2024
Synopsys has announced significant EDA and IP collaborations with TSMC for advanced node designs.
April 24, 2024
Collaboration on AI-Driven Design Flows for Optimization and Productivity, Advancements in Photonic IC Integration, Plus Broad IP Development on TSMC 2nm Technology Highlights: Production-ready...
March 26, 2024
OpenLight, a custom PASIC chip designer and manufacturer, has signed a strategic partnership agreement with VLC Photonics.
March 26, 2024
SANTA CLARA, Calif., March 25, 2024 — OpenLight, the world leader in custom PASIC chip design and manufacturing, today announced a strategic partnership with VLC Photonics, an end-to-end integrated photonics services firm, part of the Hitachi group. With this collaboration, VLC Photonics will now offer design and test services using the OpenLight process design kit (PDK). The expansion of…
March 22, 2023
Our selection of industry specific magazines cover a large range of topics.
November 28, 2022
To streamline the end-to-end design of photonic integrated circuits (PICs) and meet future demands of applications including datacom, telecom, LiDAR,...
November 24, 2022
Process Design Kit is said to enable rapid PIC designs with on-chip laser technology.
November 23, 2022
OpenLight is making available a process design kit (PDK) that will aid end-to-end design of photonic integrated circuits (PICs) and meet future demands of applications including datacom, telecom, LiDAR, healthcare, HPC, AI, and optical computing.
November 22, 2022
/PRNewswire/ -- To streamline the end-to-end design of photonic integrated circuits (PICs) and meet future demands of applications including datacom, telecom,...