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Synopsys Honored at TSMC 2023 OIP Ecosystem Forum with Multiple Partner of the Year Awards

Awards Recognize Synopsys Significant Contribution to Driving Advanced-Node Silicon Success and Technology Innovation Leadership Highlights: Certification of.

United statesKelli wheelerDan kochpatcharinSanjay baliSynopsys incGroup at synopsysTechnology innovation leadershipWave design solutionsDesign infrastructure management divisionSilicon to softwareAwards recognizeSynopsy significant contributionDriving advanced node silicon successTechnology innovationSynopsys interfaceInnovation platform

Cadence Wins Four 2023 TSMC OIP Partner of the Year Awards

Cadence Wins Four 2023 TSMC OIP Partner of the Year Awards
streetinsider.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from streetinsider.com Daily Mail and Mail on Sunday newspapers.

Dan kochpatcharinChin chi tengWave design solutionsDesign infrastructure management divisionCadence design systems incCompanies to workDigital signoff group at cadenceDesign systemsOpen innovation platformDesign infrastructureIntelligent chip explorerDesign prototyping solutionCadence integrityIntegrated fan outCadence virtuoso studioCadence tensilica

Ansys Receives Four TSMC 2023 OIP Partner of the Year Awards for Joint Development of Leading Multiphysics Technology and Design Solutions

Ansys receives four awards for joint development of advanced silicon signoff capabilities, 3D-IC prototyping, RF design, and partner collaboration / Key Highlights Ansys secured an award in the.

United statesJohn leeAnsys raptorMary kate joyceDan kochpatcharinKelsey debriynAnsys exaltoAnsys veloceDevelopment of millimeterAnsys incEcosystem forumWave design solutionsOur missionJoint developmentDesign infrastructureDesign prototyping solution

Cadence Wins Four 2023 TSMC OIP Partner of the Year Awards

Cadence Wins Four 2023 TSMC OIP Partner of the Year Awards
tmcnet.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from tmcnet.com Daily Mail and Mail on Sunday newspapers.

Dan kochpatcharinChin chi tengDigital signoff group at cadenceDesign infrastructure management divisionCadence design systems incCompanies to workWave design solutionsWins fourDesign systemsOpen innovationDesign infrastructureIntelligent chip explorerDesign prototyping solutionIntegrated fan outCadence virtuoso studioSignoff group