Page 20 - Development Kit News Today

Texas Instruments introduces a portfolio of Microcontrollers (MCU) that are capable of 10x the processing capability then exist today

Bizen wafer process used to build Zpolar Transistors with Zpolar Tunnel Logic (ZTL); Ends monopoly of Taiwanese and Korean chip producers; Addresses semiconductor shortage crisis Maximize Chip

Search for the Next (SFN), the Nottingham-based developers of the compound combination of the Bizen wafer process, Zpolar transistor and Zpolar Tunnel Logic (ZTL), has made available a family of four ITMs (Infrastructure Time Machine) – process nodes – that will enable chip designers to produce ICs in older 180nm and even one micron geometry fabs with the equivalent performance of CMOS devices made in current state-of-the-art plants.

GRENOBLE, France, Sept. 06, 2022 (GLOBE NEWSWIRE) -- Teledyne e2v announces the release of its 2-Megapixel Optimom™, the first in a range of MIPI CSI-2...

Teledyne e2v announces the release of its 2-Megapixel Optimom, the first in a range of MIPI CSI-2 optical modules. Powered by Teledyne e2v’s proprietary image sensor technology, Optimom has been thoughtfully designed to ensure there is minimum development effort required for vision-based embedded systems for robotics, logistics, drones or laboratory equipment. Optimom 2M features a

GRENOBLE, France, Sept. 06, 2022 (GLOBE NEWSWIRE) -- Teledyne e2v announces the release of its 2-Megapixel Optimom™, the first in a range of MIPI CSI-2 optical modules. Powered by Teledyne e2v’s proprietary image sensor technology, Optimom has been thoughtfully designed to ensure there is minimum development effort required for vision-based embedded systems for robotics, logistics, drones,…

UP Bridge the Gap has partnered with Intel to release two new generations of robotic development kits to simplify robotics evaluation and development. UP Bridge the Gap is a brand belonging to AAEON, a leading manufacturer of AI Edge hardware solutions.

In this article we try to provide you design software/tools companies offering product and support service to RISC-V based chip designs from small companies to biggest chip design experts such as Intel.

The engineers at UP Bridge the Gap have created two new robot developer kits thanks to a partnership with Intel.

UP Bridge the Gap has partnered with Intel to release two new generations of robotic development kits that look to simplify robotics evaluation and development.