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February 24, 2024
Bringing Taiwan to the World and the World to Taiwan
June 28, 2023
Tokyo, June 28 (CNA) Vice Premier Cheng Wen-tsan (้ญๆ็ฆ) on Wednesday paid a visit to Toshimitsu Motegi, secretary-general of Japan's ruling Liberal Democratic Party, at the party's headquarters in Tokyo.
June 28, 2023
Bringing Taiwan to the World and the World to Taiwan
May 17, 2023
RARE OCCASION: Although Japan is seeking to bolster its supply chain, it is unusual for the top executives of the worldโs major semiconductor firms to meet in one place/ Staff writer, with CNA
May 17, 2023
Bringing Taiwan to the World and the World to Taiwan
September 19, 2022
A preceding Perspectives on Innovation piece, "Japan's Semiconductor Industrial Policy from the 1970s to Today" can be read here. By: Hideki Uno Recognizing that semiconductors and the technologies they power are critical to the national security of the United States and its allies, the U.S. government announced in July 2022 its commitment to collaborating closely with Japan
August 8, 2022
World's number one semiconductor foundry TSMC has announced The completion of its Cleanroom at its Japan 3DIC R&D Center in the Tsukuba Center of the National Institute of Advanced Industrial Science and Technology (AIST).
June 25, 2022
Taipei, June 25 (CNA) A clean room facility owned by a subsidiary of Taiwan Semiconductor Manufacturing Co. (TSMC) in Japan was inaugurated Friday, paving the way for the contract chipmaker to develop high-end integrated circuit packaging and testing services.
June 24, 2022
IBARAKI, Japan, June 24, 2022 — TSMC (TWSE: 2330, NYSE: TSM) today announced that its subsidiary, the TSMC Japan 3DIC R&D Center, has completed [...]
June 24, 2022
Taiwan Semiconductor Manufacturing Co (TSMC, ๅฐ็ฉ้ป) yesterday said its subsidiary TSMC Japan 3DIC R&D Center has completed construction of its clean room in the Tsukuba Center of the National Institute of Advanced Industrial Science and Technology. The center was established in Japanโs Ibaraki Prefecture in March last year to pursue research into the next generations of 3D silicon stacking and advanced packaging technologies in materials science, the chipmaker said in a statement. The ...