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February 22, 2023
Teledyne e2v and Texas Instruments (TI) have collaborated on a new radiation-tolerant DDR4 modular platform.
February 21, 2023
Grenoble, February 21st, 2023 – To help satellite OEMs to streamline their system development work, as well as reducing the time and engineering effort involved, Teledyne e2v and Texas Instruments (TI) collaborated on a new radiation-tolerant DDR4 modular platform. This field-proven hardware consists of a 4GB/8GB capacity DDR4T0xG72 DDR4 memory from Teledyne e2v accompanied by…