Apple Supplier TSMC announced 3nm chips with Revolutionary 'FinFlex' Architectural Innovation, 2nm Chips starting production in 2025 & more
Late yesterday TSMC showcased the newest innovations in its advanced logic, specialty, and 3D IC technologies at the Company’s 2022 North America Technology Symposium, with the next-generation leading-edge N2 process powered by nanosheet transistors and the unique FINFLEX™ technology for the N3 and N3E processes making their debut.
United States Technology Symposiums America Technology Symposium D Silicon Stacking Solutions Patently Apple Disappointingly Delayed
Source: patentlyapple.com