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SK hynix announces semiconductor advanced packaging investment in Purdue Research Park

SK hynix announces semiconductor advanced packaging investment in Purdue Research Park
streetinsider.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from streetinsider.com Daily Mail and Mail on Sunday newspapers.

Purdue universityUnited statesSouth koreaWest lafayetteMichael berghoffBrian edelmanKwak noh jungGregory deasonMark lundstromEric holcombRichard michalMung chiangTim dotyMitchelle daniels jrErin easterSue ellspermann

Gov Holcomb, IEDC announce generational multi-billion-dollar investment to make Indiana leader in semiconductor packaging

Gov Holcomb, IEDC announce generational multi-billion-dollar investment to make Indiana leader in semiconductor packaging
forextv.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from forextv.com Daily Mail and Mail on Sunday newspapers.

United statesPurdue universitySouth koreaWest lafayetteRepublic of koreaEricj holcombTodd youngMung chiangKwak noh jungErin easterDavid rosenbergStates hyundong choWhite house office of scienceLuxemburg stock exchangeKorea exchangeChiang at purdue university

SK hynix announces semiconductor advanced packaging investment in Purdue Research Park

WEST LAFAYETTE, Ind., April 03, 2024 (GLOBE NEWSWIRE) SK hynix Inc. announced Wednesday (April 3) that it plans to invest close to $4 billion.

Purdue universityUnited statesSouth koreaWest lafayetteMitchelle daniels jrSue ellspermannEric holcombTony roswarskiMitch danielsKwak noh jungMark lundstromGregory deasonMichael berghoffTim dotyErin easterRichard michal

Gov Holcomb, IEDC announce generational multi-billion-dollar investment to make Indiana leader in semiconductor packaging

WEST LAFAYETTE, Ind., April 03, 2024 (GLOBE NEWSWIRE) Governor Eric J. Holcomb, Secretary of Commerce David Rosenberg and Purdue University P.

West lafayetteUnited statesPurdue universitySouth koreaRepublic of koreaEricj holcombKwak noh jungErin easterDavid rosenbergTodd youngStates hyundong choMung chiangPurdue birck nanotechnology centerTechnology arati prabhakarIedcthe indiana economic development corporationKorea exchange

SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana

To build advanced packaging facility for next-generation HBM, while collaborating with Purdue University for R&D Selects Indiana for strong support provided by the state and local government, infrastructure for manufacturing, and talent at Purdue. Industry s first investment in advanced packaging for AI products on American soil, strengthens supply-chain resilience SEOUL, South Korea, April 4, 2024 /PRNews.

United statesSoult ukpyolsiSouth koreaWest lafayetteState of indianaPurdue universityRepublic of koreaLafayette erin easterKwak noh jungTodd youngChoi woojinDavid rosenbergJeong joon yuArun venkataramanStates hyundong choMung chiang

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