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Fabrication of Flexible Electronics Improved | Printed Electronics World

Researchers have developed a technique to improve the flexibility of ultra-thin electronics, such as those used in bendable devices or clothing. Published in Science Advances, the study details the use of water vapor plasma to directly bond gold electrodes fixed onto separate ultra-thin polymer films, without needing adhesives or high temperatures.
Takao Someya Senior Research Scientist Kenjiro Fukuda Cluster For Pioneering Research Emergent Matter Science Pioneering Research Science Advances

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