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US-China Chip Rivalry Finds New Flashpoint

The semiconductor industry is being revolutionized by semiconductor packaging, which involves encasing chips in protective materials, ensuring their safety, and enabling their connection to electronic devices. When comparing this sphere within the semiconductor industry globally, it is evident that the US and China are leading in advancements.
United States White House District Of Columbia Jim Mcgregor Robyn Patterson National Advanced Packaging Manufacturing Program

US-sanctioned Huawei denies breakthrough in chip packaging tech as speculation mounts on firm's efforts to overcome trade restrictions

Speculation has been rife about Huawei’s development of a new semiconductor packaging technology that can achieve 7-nanometre performance for chips.
Huawei Technologies Co Emiconductor Packaging Technology Us Sanctions Nanometre Performance Semiconductor Manufacturing International Corp Telecommunications Equipment
Source: scmp.com

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