Page 112 - Emiconductor News Today

Koreas industry ministry said Thursday it agreed with Dutch semiconductor equipment supplier ASM to boost cooperation for the firms planned investment of $100 million to build a production factory and a research and development center in Korea.

Robust semiconductor trade flows between China and South Korea are under pressure as the US seeks to isolate Beijing from global tech supply chains, but the policy will hurt Korea’s chip giants, say analysts.

Washington wants to deploy more Western mobile phone networks in the subcontinent to counter Chinas Huawei Technologies Co Ltd, to welcome more Indian computer chip specialists to the United States and to encourage companies from both countries to collaborate on military equipment like artillery systems, , india us relationship, partnership, semiconductor, Artificial Intelligence (AI), china

Kioxia Group is increasing the usage of renewable energy by installing large-scale solar power generation systems for the first time at its Kitakami Plant and Yokkaichi Plant.

United Microelectronics Corporation , a leading global semiconductor foundry, and Cadence Design Systems, Inc. today announced that the Cadence® 3D-IC reference flow, featuring the... | February 1, 2023

SK hynix suffered its first quarterly operating loss in 10 years, reiterating that the size of its annual investment will be halved this year compared to last year. During Wednesda...

Chinas semiconductor industry has become a key target of the United States, which has imposed a slew of export restrictions targeting several parts of the countrys chip sector supply chain as it... | January 31, 2023

Toshiba Electronic Devices & Storage Corporation ("Toshiba") has launched automotive 40V N-channel power MOSFETs, “XPQR3004PB” and “XPQ1R004PB,” that use the new L-TOGL™ (Large Transistor Outline Gull-wing Leads) package and feature a high drain current rating with low On-resistance.

Dublin, Jan. 31, 2023 (GLOBE NEWSWIRE) -- The "Super Junction MOSFET Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast...

Jeong Cheol-dong, CEO and president of LG Innotek, vowed that his company will become a global leader in a next-generation semiconductor packaging substrate known as flip chip ball grid array (FC-BGA), according to the IT parts arm of LG Group, Monday. LG Innotek said it held a ceremony recently at its FC-BGA factory in Gumi, North Gyeongsang Province, to commemorate bringing in equipment.