Osbert Cheng News Today

99.1 Announcement on 2023/10/11: UMC will convene Q3 2023 Investor Conference 99.2 Announcement on 2023/10/25: Announcement of board meeting approved the consolidated financial...

United Microelectronics, a global semiconductor foundry, and Cadence Design Systems, have announced that the Cadence 3D-IC reference flow, featuring the Integrity 3D-IC Platform, has been certified for UMC’s chip stacking technologies.

HSINCHU, Taiwan & SAN JOSE, Calif., February 2, 2023—United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, and Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that the Cadence® 3D-IC reference flow, featuring the Integrity™ 3D-IC Platform, has been certified for UMC’s chip stacking technologies, enabling faster time to market. UMC’s…

United Microelectronics Corporation , a leading global semiconductor foundry, and Cadence Design Systems, Inc. today announced that the Cadence® 3D-IC reference flow, featuring the... | February 1, 2023

Cadence Design Systems, Inc. and United Microelectronics Corporation (UMC) today announced that customers are adopting their certified mmWave...

Siemens Digital Industries Software, in collaboration with semiconductor foundry United Microelectronics (UMC), has developed and implemented a new multi-chip 3D integrated circuit (IC) planning, assembly validation and parasitic extraction (PEX) workflow for UMC’s wafer-on-wafer and chip-on-wafer technologies.

United Microelectronics and Cadence Design Systems have announced that the Cadence analogue/mixed-signal (AMS) IC design flow has been certified for UMC’s 22ULP/ULL process technologies.