Page 80 - Emiconductor News Today

The event is hosted by KAUST and co-organized with the Research Development and Innovation Authority and King Adulaziz City for Science and Technology (KACST), with KAUST President Dr. Tony Chan and KACST President Dr. Munir M. Eldesouki officiating as honorary chairs.

Minister Vaishnaw is on a three-day visit to USA, where he met Google CEO Sundar Pichai and is expected to meet leaders of chip companies including Intel, Micron, Global Foundries, among others to woo them to invest in India.

HSINCHU, May 10, 2023 /PRNewswire-FirstCall/ -- ChipMOS TECHNOLOGIES INC. , an industry leading provider of outsourced semiconductor assembly and test services , today reported its unaudited... | May 10, 2023

Amtech Systems, Inc. , a manufacturer of capital equipment, including thermal processing and wafer polishing, and related consumables used in fabricating semiconductor devices, such as silicon... | May 10, 2023

Product samples were delivered to customers as planned; results validate the leadership performance expected from vertical GaN power devices vs. competing technologiesProduct development agreements with

TSMCs decision to invest an unprecedented sum into US and Europe factories followed key clients such as Apple Inc. and Nvidia Corp. telling the chipmaker, either implicitly or explicitly, that they will buy from these new factories

Samsung Electronics has been suffering from the memory industry slump. Investment in equipment is expensive and increasingly a burden to the company. Sources from South Korean memory industry say Samsung Electronics may introduce AI and IoT-based advanced sensing and cooling technologies to raise production efficiency and cut costs.

TSMC has recently announced SoIC-P, microbump versions of its System on Integrated Chips (SoIC) solutions providing a cost-effective way for 3D chip stacking.

Neo Semiconductor has announced the release of 3D X-DRAM, the worlds first 3D NAND-like DRAM, which the company believes would eliminate DRAMs capacity issue and replace the entire 2D DRAM industry. Relevant patent applications were published with the United States Patent Application Publication on April 6, 2023.

Daly, an independent consultant in the microelectronics industry, will be responsible for providing strategic counsel and inputs for the semiconductor business.