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"Enhancement of thermal and mechanical properties of microencapsulated " by Meiyong Hu, Dawei Wang et al.

The low thermal conductivity of microencapsulated phase change materials (MEPCMs) limits the latent heat charging and discharging rates for various applications. To overcome this limitation, we prepared MEPCM by co-surfactants of polyvinyl alcohol and high thermal conductivity graphene oxide (GO) through an emulsion polymerization process. Fourier transformation infrared spectroscopy and Raman spectra results verified that GO was successfully added to the MEPCMs' hybrid polymer shell. The c...
Emulsion Polymerization Graphene Oxide Phase Change Material Hermal Conductivity Enhancement
Source: uow.edu.au

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