NexLogic Technologies, Inc. Announces Installation of Finetech FINEPLACER® lambda Sub-Micron Die Bonder on Its PCB Microelectronics Assembly Floor
NexLogic Technologies, Inc. Announces Installation of Finetech FINEPLACER® lambda Sub-Micron Die Bonder on Its PCB Microelectronics Assembly Floor Share Article NexLogic Technologies, Inc., an EMS provider offering both PCB SMT and microelectronics assemblies, announces the installation of a highly advanced Finetech FINEPLACER® lambda sub-micron die bonder system in its PCB microelectronics assembly line. According to the manufacturer, Finetech, the new die bonder has accuracies of 0.5 µm an...
Source: prweb.com