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Advanced Packaging market has 10 6% CAGR to hit $79bn in 2028

The Advanced Packaging market, valued at $44.3 billion in 2022, is expected to grow at a CAGR of 10.6% from 2022 to 2028, reaching $78.6 billion in 2028,

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Success of CHIPS Act Depends on Quickly Establishing a Pilot Facility for Integrated Circuit Substrates, Tech Leaders Warn

The success of the CHIPS for America program depends on establishing a U.S. pilot facility for manufacturing integrated circuit (IC) substrates; and getting it

United statesJohnw mitchellUs congressTechnologist councilIc substrate manufacturing centerFlip chip ball grid arrayFlip chip scale packageManufacturing centerPresident bidenCommunications director

Huawei HiSilicon is BACK!!! Set to launch a new flagship Kirin chip

Huawei HiSilicon is BACK!!! Set to launch a new flagship Kirin chip. However, this chip is not ready for mass production

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Success of CHIPS Act Depends on Quickly Establishing a Pilot Facility for Integrated Circuit Substrates, Tech Leaders Warn

Success of CHIPS Act Depends on Quickly Establishing a Pilot Facility for Integrated Circuit Substrates, Tech Leaders Warn
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United statesJohnw mitchellUs congressTechnologist councilIc substrate manufacturing centerFlip chip ball grid arrayFlip chip scale packageManufacturing centerPresident biden
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