Embedded Die News Today

The advanced IC substrate market is expected to grow at an 11% CAGR from $15 billion in 2022 to nearly $34 billion in 2028, says Yole Developpement. Asian

The Advanced Packaging market, valued at $44.3 billion in 2022, is expected to grow at a CAGR of 10.6% from 2022 to 2028, reaching $78.6 billion in 2028,

Expansion of the electronics sector, and an increase in demand for porous silicon substrates across various industry verticals drive the global porous silicon substrates market growth. By end

/PRNewswire/ -- Allied Market Research published a report, titled, "Porous Silicon Substrates Market By Type (Microporous Silicon Substrate, Mesoporous Silicon...

/PRNewswire/ -- Allied Market Research published a report, titled, "Anodic Aluminum Oxide Wafer Market By Wafer Type (6 inch, 8 inch, 12 inch, and Others),...

Innosilicon, a domestic IP provider, ASIC design house, and GPU-enabled leader, announced the first homegrown development of Chiplet solution compatible with the UCIe standard IP solution - Innolink™ Chiplet, which is the first cross-process, cross-package Chiplet connectivity solution, and has been successfully verified in mass production on advanced processes.

Embedded Die Packaging Technology Market Company Landscape Analysis, Key Strategic Moves, Key Recent Developments, And Technological Roadmap 2021 – 2

Embedded Die Packaging Technology Market Company Landscape Analysis, Key Strategic Moves, Key Recent Developments, And Technological Roadmap 2021 – 2

/PRNewswire/ -- Allied Market Research published a report, titled, "Embedded Processor Market By Type (Microprocessor, Microcontrollers, Digital Signal...