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Cadence Collaborates with GUC on AI, HPC and Networking in Advanced Packaging Technologies

Cadence Collaborates with GUC on AI, HPC and Networking in Advanced Packaging Technologies
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Sanjive agarwalaGlink cowoDan kochpatcharinIgor elkanovichGlobal unichip corpIp group at cadenceCadence design systems incCompanies to workDesign infrastructure management divisionDesign systemsGlobal unichipIntelligent system designIntelligent system design strategyCadence design systems

CADENCE DESIGN SYSTEMS, INC : Stock Market News and Information | CDNS| US1273871087

Cadence 112G-LR SerDes silicon proven in GUC’s HBM3/GLink/CoWoS platform . | April 26, 2023

Igor elkanovichGlink cowoDan kochpatcharinSanjive agarwalaIp group at cadenceDesign infrastructure management divisionCadence design systems incCompanies to workGlobal unichip corpCadence design systemsGlobal unichipIntelligent system designIntelligent system design strategyIntelligent systemNc stock exchangePress release

GUC Taped Out 3nm 8 6Gbps HBM3 and 5Tbps/mm GLink-2 5D IP Using TSMC Advanced Packaging Technology

GUC Taped Out 3nm 8 6Gbps HBM3 and 5Tbps/mm GLink-2 5D IP Using TSMC Advanced Packaging Technology
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Sean taiIgor elkanovichGlobal unichip corpGlobal unichip

GUC tapes out 3nm 8 6Gbps HBM3 and 5Tbps/mm GLink-2 5D IP using TSMC advanced packaging technology

Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out a test chip with an 8.6Gbps HBM3 Controller and PHY and GLink 2.3LL for AI/HPC/xPU/Networking applications. GLink 2.3LL die-to-die interface provides best-in-class power, performance, and area (PPA) with 5ns end-to-end latency, 5Tbps/mm beach-front (2.5T full-duplex) and 0.27pJ/bit power efficiency. The test chip is taped out at the TSMC 3nm process and adopts the TSMC CoWoS advanced packaging technology.

Sean taiIgor elkanovichGlobal unichip corpGlobal unichipAdvanced packagingNews coverageEws highlightsPress release

GUC Taped Out 3nm 8 6Gbps HBM3 and 5Tbps/mm GLink-2 5D IP Using TSMC Advanced Packaging Tech

GUC Taped Out 3nm 8 6Gbps HBM3 and 5Tbps/mm GLink-2 5D IP Using TSMC Advanced Packaging Tech
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Igor elkanovichSean taiGlobal unichip corpGlobal unichip