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September 16, 2022
AMD Radeon RX 7900 XT RDNA 3 graphics card PCB: Navi 31 GPU with 7 chiplets, 3 x 8-pin PCIe power connectors for up to 450W of power.
August 24, 2022
Intel details its 3D Foveros packaging technology: LEGO-style chiplet CPU design for next-gen Meteor Lake, Arrow Lake, Lunar Lake CPUs of the future.
June 13, 2022
AMD has confirmed that its CDNA 3 architecture is the worlds first exascale APU design: both CPU + GPU chiplets on single package.
April 5, 2021
AMD patent published on April 1 teases next-gen GPU chiplet technology with inter-chiplet bridge and integrated cache, and more.
January 2, 2021
AMD submits GPU chiplet design patent to USPTO on December 31 that teases the future of GPU technology, an NVIDIA destroyer.