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5 Min Read SHANGHAI (Reuters) - Tsinghua Unigroup, a Chinese conglomerate that has long sought to become a semiconductor powerhouse, is now caught between a rock and a hard place as debt woes mount while key chip units are failing to thrive, sources with knowledge of the matter said. FILE PHOTO: The logo of Tsinghua Unigroup is seen in its office in Beijing, China, November 15, 2015. REUTERS/Kim Kyung-Hoon Best known for an unsuccessful $23 billion bid for U.S. chipmaker Micron Technology Inc in 2015, Unigroup in November shocked investors with a default on a 1.3 billion yuan ($200 million) bond. Including that bond, Unigroup has now either defaulted or had cross-defaults triggered on seven onshore and offshore bonds worth about $3.6 billion, according to Refinitiv data.

Hong kongKane wuJulie zhuEdwina gibbsAndrew galbraithTsinghua unigroupZhao weiguoJosh horwitzGu wenjunThomson reuters trust principlesSamsung electronics ltdTsinghua universityIntel corpMicron technology incUnigroup chairman zhao weiguoThomson reuters trust