New Electronics - Die-to-wafer self-assembly breakthrough delivers accuracy and throughput
In what is being described as a breakthrough for the future of die-to-wafer (D2W) bonding, CEA-Leti and Intel have optimised a hybrid direct-bonding, self-assembly process that has the potential to increase the alignment accuracy as well as fabrication throughput by several thousand dies per hour.
Emilie Bourjot Assembly For High Alignment Accuracy Technology Conference Die To Wafer Self Assembly High Alignment Accuracy High Throughput
Source: newelectronics.co.uk