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June 23, 2022
Researchers developed an integrated approach combining NGS, molecular barcoding, machine learning, and bioinformatics to enable high-throughput detection of SARS-CoV-2 variants.
June 23, 2022
The Global In Vitro Toxicity Testing Market size is expected to reach $37. 5 billion by 2028, rising at a market growth of 10. ...
June 22, 2022
Porvair Sciences announce eGecko² – an automated barcode application system that provides the ideal high throughput solution for precisely applying barcode labels onto racks of plates and Petri dishes.
June 17, 2022
INTEGRA Biosciences’ electronic handheld pipetting solutions are helping to improve the throughput capacity of bulk RNA barcoding and sequencing (BRB-seq) at Alithea Genomics in Switzerland.
June 14, 2022
Orbit Discovery Ltd., (“Orbit”) a privately held biopharmaceutical company focused on discovering candidate peptide therapeutics harnessing proprietary affinity and cell-based functional screening platforms, has been awarded a Smart grant by Innovate UK, the UK’s innovation agency.
June 14, 2022
MolGen b.v. of Veenendaal (NL), a global solutions provider of innovative extraction DNA/RNA isolation technology, hardware, systems, consumables and reagents for human diagnostics, agricultural research, and the biotech industry is attending the Analytica Fair, in Munich, on the 21st- 24th of June 2022.
June 13, 2022
Today, at the 70th Conference on Mass Spectrometry and Allied Topics, Evosep demonstrates new applications for standardization of high throughput single cell proteomics, higher throughput clinical analysis, and improved diabetes monitoring.
June 7, 2022
In what is being described as a breakthrough for the future of die-to-wafer (D2W) bonding, CEA-Leti and Intel have optimised a hybrid direct-bonding, self-assembly process that has the potential to increase the alignment accuracy as well as fabrication throughput by several thousand dies per hour.
June 6, 2022
CEA-Leti reported the optimization of a hybrid direct-bonding, self-assembly process with the potential to increase the alignment accuracy as well as
June 2, 2022
SAN DIEGO – June 2, 2022 – In a breakthrough for the future of die-to-wafer (D2W) bonding, CEA-Leti and Intel have optimized a hybrid direct-bonding, self-assembly process that has the potential to increase the alignment accuracy as well as fabrication throughput by several thousand dies per hour. The approach uses capillary forces of a water droplet…