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July 13, 2023
Highlights: • Certified Cadence flows are production-ready, and design IP is readily available for customers looking to create Intel 16 designs now • Customers can confidently deliver a wide variety of HPC, consumer and USMAG applications based on the Cadence-certified flows SAN JOSE, Calif., July 12, 2023 — Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced…
July 11, 2023
Highlights: Certified Cadence flows are production-ready, and design IP is readily available for customers looking to create Intel 16 designs now Customers can confidently deliver a wide variety of HPC, consumer and USMAG applications based on the Cadence-certified flows
May 30, 2023
Cadence today announced it has continued to expand its collaboration with Arm to advance mobile device silicon success, providing customers with a faster path to tapeout through use of Cadence® digital and verification tools and the new Arm® Total Compute Solutions 2023 (TCS23), which includes the Arm Cortex®-X4, Arm Cortex-A720 and Cortex-A520 CPUs and Immortalis™-G720, Mali™-G720 and Mali-G620 GPUs.
May 29, 2023
Donor Relations/Grants Management Job in Poland, requiring 0-2 years of experience, from IRC; closing on 30 Jun 2023
May 18, 2023
Donor Relations/Grants Management Job in USA, requiring 3-4 years of experience, from IRC; closing on 18 Jul 2023
May 18, 2023
Donor Relations/Grants Management Job in USA, requiring 3-4 years of experience, from IRC; closing on 18 Jul 2023
February 2, 2023
HSINCHU, Taiwan & SAN JOSE, Calif., February 2, 2023—United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, and Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that the Cadence® 3D-IC reference flow, featuring the Integrity™ 3D-IC Platform, has been certified for UMC’s chip stacking technologies, enabling faster time to market. UMC’s…
February 1, 2023
United Microelectronics Corporation , a leading global semiconductor foundry, and Cadence Design Systems, Inc. today announced that the Cadence® 3D-IC reference flow, featuring the... | February 1, 2023
January 23, 2023
Highlights: • Using Innovus Implementation, GUC delivered a 3.16GHz HPC core design with 3.5M instances on the TSMC N3 process technology • GUC realized a 9% area shrink and an 8% reduction in power consumption on a CPU design on the TSMC N5 process using the AI-enabled Cadence Cerebrus SAN JOSE, Calif., January 19, 2023 —Cadence…
October 11, 2022
Highlights: • Provides customers with a first-of-its-kind fully automated environment featuring a massively parallel and distributed architecture • Supports design optimization and signoff with unlimited capacity, delivering overnight turnaround time while significantly reducing design power • Cloud-ready solution advances emerging design areas, including hyperscale computing, 5G communications, mobile, automotive and networking SAN JOSE, Calif., October…