Integrated Chips News Today

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Chip foundry plans to qualify systems for small form factor pluggables in 2025.

TSMC introduced its System-on-Wafer (TSMC-SoW™) technology, an innovative solution to bring revolutionary performance to the wafer level in addressing the

TSMC plans to integrate HBM4 with system-on-wafer designs in 2027.

Taipei, June 8 (CNA) Taiwan Semiconductor Manufacturing Co. (TSMC) on Thursday announced the opening of a new packaging and testing fabrication plant in Miaoli, northern Taiwan, as the company prepares to commercialize its SoIC (System on Integrated Chips) process technology.

HSINCHU, Taiwan, R.O.C, Jun. 8, 2023—TSMC (TWSE: 2330, NYSE: TSM) today announced the opening of its Advanced Backend Fab 6, the company’s first all-in-one [...]

Hitachi in India has today announced their collaboration with Ms NASH INDUSTRIES a pioneer offering solutions with distinctiveness in Design Precision Sheet Metal Stamping Fabrication and Assemblies to offer controllers for Brushless DC motors with the Integrated Single Chip ICs manufactured at Hitachi Power Semiconductor Device Ltd. Japan.

BusinessWire India, Bengaluru, May 24: Hitachi in India has today announced their collaboration with M/s NASH INDUSTRIES, a pioneer, offering solutions with distinctiveness in Design, Precision Sheet Metal Stamping, Fabrication and Assemblies, to offer controllers for Brushless DC motors with the Integrated Single Chip ICs manufactured at Hitachi Power Semiconductor Device, Ltd.

TSMC has recently announced SoIC-P, microbump versions of its System on Integrated Chips (SoIC) solutions providing a cost-effective way for 3D chip stacking.

Leading foundry services announced a number of advances on future semiconductor technologies.