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Applied Materials' New Ioniq™ PVD System Solves Wiring Resistance Challenges of 2D Scaling – EEJournal

SANTA CLARA, Calif., May 26, 2022 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today introduced a new system that re-engineers the deposition of transistor wiring to significantly reduce electrical resistance, which has become a critical bottleneck to further improvements in chip performance and power. Chipmakers are using advances in lithography to shrink chips to the 3nm…
Prabu Raja Semiconductor Products Group At Applied Materials Applied Materials Materials Inc Integrated Materials Solution Senior Vice President

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Applied Materials Technologies Enable 2D Scaling with EUV and 3D Gate-All-Around Transistors

Applied extends 2D EUV logic scaling with Stensar™ CVD alternative to spin-on patterning films Previews broadest portfolio of technologies for 3D Gate-All-Around transistors including two new IMS™ systems SANTA CLARA, Calif., April 21, 2022 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today introduced innovations that help customers continue 2D scaling with EUV and detailed the industry’s…
Prabu Raja Semiconductor Products Group At Applied Materials Materials Solutions Materials Inc Applied Materials Senior Vice President

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